Projects under Research Solution Cases

Slicing technology

Developing cutting fluid is aimed at the demands for better wafer properties and slicing efficiency.

  1. Especially suitable for larger wafer size and lower TTV.

  2. Suitable for thinner diamond wires and related cutting process, lower broken ratio of diamond wires.

  3. Lower microscopic roughness and saw marks of wafer surface, suitable for thinner wafer and the following cell process.

  4. Lower COD.